Non-destructive Acoustic Metrology

 

Tue, 07/22/2014 - 2:05pm

 

Rudolph Technologies Inc. has announced the availability of its new SONUS Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs). SONUS Technology is a non-contact, non-destructive acoustic metrology and defect detection technique that is designed to be of higher resolution, faster, and less costly than alternative techniques.

Copper pillar bumps and TSVs are key enabling technologies in the rapidly growing field of advanced packaging where 2.5-D and 3-D assembly schemes are driving the "More than Moore" roadmap. Rudolph has collaborated with TEL NEXX specifically to develop pillar bump and TSV plating process control based on SONUS Technology.

Copper pillar bumps and TSVs are critical interconnect technologies enabling 2.5-D and 3-D packaging. Plating process control for copper pillar bumping is directly related to the mechanical integrity of the interconnect and final device performance. Likewise, the quality of the TSV fill is critical to the electrical performance of stacked devices. Rudolph’s patented SONUS Technology offers the unique ability to measure individual films and film stacks to thicknesses of 100 µm and detect voids as small as 0.5 µm in TSVs with aspect ratios of 10:1 or greater.

Rudolph Technologies Inc.